All products and services
1~24 item / All 24 items
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Ultrasonic Process Optimization System 'UMOS'
For those struggling with setting joining and cutting conditions tailored to various materials!
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Direct bonding of substrates using ultrasonic waves.
Introducing an application that uses ultrasonic bonding to connect flexible substrates with low resistance!
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DMB bonding application using ultrasonic bonding
Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.
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Flexible substrate ultrasonic bonding application
There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!
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Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>
Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.
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Flip Chip Bonder "FB2000SS"
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'
Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.
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Ultrasonic Ribbon Bond RB0300SS
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
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Ultrasonic Pin Joining Device PB2000MS
In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.
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Introduction to Heat Sink Formation Technology Using Ultrasonic Welding
Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).
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Introducing the latest applications for power devices!
From R&D for power devices to mass production. Providing ultrasonic bonding equipment!
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Introducing the latest applications of next-generation secondary batteries!
From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!
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Ultrasonic cutting contract processing service
Ultrasonic cutting technology that achieves a clean cut surface without warping, bending, or dragging of composite materials.
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Ultrasonic welding contract processing service
Stable ultrasonic bonding technology using rigid clamps applicable to a wide range of applications.
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Ultrasonic Metal Joining Device UB2000/3000/5000LS
Ideal for power devices! The ultrasonic head is highly rigid and compact!
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Standalone Ultrasonic Welding Machine UB2000/3000/5000SA
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
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Standalone Ultrasonic Metal Welding Machine UB050/300/500SA
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
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Green Sheet Cutter GC1000MS
Equipped with process monitoring features! A green sheet cutter that accommodates everything from fine devices to 6mm thick materials.
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Ultrasonic Metal Joining Device UP-Lite1500
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
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Ultrasonic Cutter UC1000LS
Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.
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Mass production ultrasonic metal joining device TB1000MS
This is a mass production ultrasonic metal joining device suitable for inverter production!
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Ultrasonic Opening and Impregnation Device UD1000MS
Achieving fully immersed UD tape manufacturing with a groundbreaking device size.
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Ultrasonic Seam Welding Machine SB200/400CE
Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.
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Ultrasonic High-Precision Flip Chip Bonder FA2000SS
Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.
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