Fully automatic high-precision die bonder "FINEPLACER femto2"

Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.

The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.

basic information

【Main Specifications】 Mounting Accuracy: ±0.5μm @ 3 Sigma Optical Field of View: 3.8mm × 2.7mm Optical Field of View Resolution: 1μm / pix Supported Chip Size: (Minimum) 0.03mm × 0.03mm to (Maximum) 100mm × 100mm θ Fine Adjustment: ±9° / 3.5μrad X Movement/Accuracy: 660mm / 0.02μm Y Movement/Accuracy: 150mm / 0.02μm Z Movement/Accuracy: 10mm / 0.02μm Substrate Heating Temperature: 500℃ Bonding Load Range: 0.05N to 1000N *For more details, please refer to the documentation. Feel free to contact us with any inquiries.