Semiconductors (LSI, IC), power modules

We will extract and propose appropriate reliability evaluations and testing contents based on the anticipated failure modes. ■ Failure Analysis - Good product analysis - Investigation of malfunction, disconnection, short circuit, and data corruption - Verification of defect reproduction with individual ICs - Resin opening (decap) - LSI circuit modification ■ In addition to general environmental testing, we will also address the following: - Power cycle testing for high-power devices - Temperature cycle testing using high-power constant temperature chambers - Support for authenticity determination of market-distributed products (products without manufacturer warranty) - Screening of space components (DPA)