Main Roller Groove Inspection Machine 'MPI-300A'
Achieving full-length imaging, recording, and measurement! Groove inspection machine for wafer slicers.
The "MPI-300A" is a main roller groove inspection machine that can capture, record, and measure the entire length of groove shapes through profile cross-section imaging and electric scanning. The transmitted light from the profile camera creates a shadow cross-section of the roller, which is captured by a telecentric lens camera as it moves along the entire length of the roller, allowing for frame recording and image measurement. It is designed to be set next to the slicer on a cart for easy adjustment and inspection. 【Features】 - Capable of capturing, recording, and measuring the entire length through profile cross-section imaging and electric scanning - Supports inspection of slicer-mounted rollers and wire mode - Easily adjustable when set next to the slicer on a cart - Can be used as data for wear inspection, durability monitoring, and determining roller replacement timing *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications】 ■Measurement Items: Groove angle, groove width, crest width, groove depth, distance between grooves, groove number, judgment function ■Measurement Range: Roller diameter from 150mm to 400mm, length 650mm ■Device Functions: Imaging field H7mm V4mm resolution 3.4μm, imaging 30 seconds, measurement 120 seconds ■Device Installation: Set beside the slicer to roughly adjust the parallelism and height of the slicer roller with a sliding arm and fine-tune with an XZ stage ■Operation: Input groove pitch on the screen and set the start and end points by moving the stage, then start ■Cart External Dimensions: Approximately width 1000mm × depth 600mm × height 1000mm, weight approximately 30kg ■Storage and Power: Controller, measurement laptop, and lighting power stored in the cart, AC100V 4 outlets 10A *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Main roller groove inspection for wafer slicers ■ Acceptance inspection of rollers ■ Slicer roller inspection ■ Slicer implementation roller inspection ■ Wire mode inspection ■ Wear inspection ■ Durability monitoring ■ Data for determining roller replacement timing *For more details, please download the PDF or feel free to contact us.
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Since our company's establishment in 1986, we have long been engaged in semiconductor-related businesses that support Japan's cutting-edge technology. On the hardware side, we have developed construction and manufacturing environments, including clean rooms. On the human resources side, we have focused on training semiconductor engineers and establishing a service system that can promptly respond to customer needs. Last year, we participated in SEMICON Japan for the first time, and by directly interacting with many industry stakeholders, we were able to learn again what is currently needed and what services should be created. At the same time, the morale within the company has been rising, and we are actively conducting sales activities. It is said that the Japanese economy is finally showing signs of recovery. However, even just looking at the semiconductor industry, the entry of overseas manufacturers and the significant improvement in technology and services are remarkable, so we aim to enhance our international competitiveness in our sales expansion. Not only domestically but also in response to the era of globalization, our role as a hub connecting North America and Asia, especially given our excellent airport access, will further increase.