◉ TCF-C500 超高温小型実験炉Max2900℃
◉ TCF-C500 超高温小型実験炉Max2900℃
Max2900℃(カーボン炉）、Max2400℃（メタル炉） ・有効加熱エリア 70 x 70 x1 00mm 新素材・新材料開発、及び半導体・電子部品・燃料電池・大陽電池などの先端基礎技術開発部門でのさまざまなアプリケーションに対応。 小片試料を最高2900℃まで加熱実験ができるR&D用超高温小型実験炉。 実験室での超高温加熱実験、新素材開発などのさまざまな焼成実験を行うことができます。 ◆主な特徴◆ ・省スペース ・ロータリーポンプ、コンプレッサー付属 ・インターロック：断水警報、過昇温、ガス圧力低下 ◆基本仕様◆ ・電源仕様：AC200V 75A NFB 50/60HZ（C-500） ・Max2900℃（カーボン炉）、2400℃（メタル炉）、 ・プログラム温度調節計、C熱電対 ◆オプション◆ ・記録計 ・ターボ分子ポンプ ・るつぼ ◆主なアプリケーション◆ ・新素材開発 ・燃料電池 ・その他
31～45 件を表示 ／ 全 45 件
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Sputtering and deposition source hybrid thin film device [nanoPVD-ST15A]
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
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Vacuum Furnace "Mini-BENCH Ultra-High Temperature Tabletop Experimental Furnace"
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
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Vacuum Furnace "Mini-BENCH-prism Ultra-High Temperature Experimental Furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
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Annealing furnace "ANNEAL wafer annealing device"
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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Sputtering device "MiniLab series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
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Sputtering device "MiniLab-060"
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
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Vacuum Deposition Device "MiniLab-080"
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
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Sputtering device 'nanoPVD-S10A'
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
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Vacuum deposition device 'MiniLab-090' (for glove box)
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
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Vacuum Deposition Device "MiniLab Series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
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Vacuum Deposition Device "nanoPVD-T15A"
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
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Sputtering device 'MiniLab-026'
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
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Vacuum Deposition Device "MiniLab-026"
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
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Annealing furnace "Mini-BENCH-prism ultra-high temperature experimental furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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