◉ TCF-C500 Ultra High Temperature Small Experimental Furnace Max 2900℃

◉ TCF-C500 Ultra High Temperature Small Experimental Furnace Max 2900℃
Max 2900℃ (Carbon furnace), Max 2400℃ (Metal furnace) - Effective heating area: 70 x 70 x 100 mm Supports various applications in new material development and advanced fundamental technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells. A compact R&D ultra-high-temperature experimental furnace capable of heating small samples up to 2900℃ for experimental purposes. It can conduct various firing experiments such as ultra-high-temperature heating experiments and new material development in the laboratory. ◆ Main Features ◆ - Space-saving - Includes rotary pump and compressor - Interlock: water cut-off alarm, overheating, gas pressure drop ◆ Basic Specifications ◆ - Power supply specifications: AC200V 75A NFB 50/60HZ (C-500) - Max 2900℃ (Carbon furnace), 2400℃ (Metal furnace) - Programmable temperature controller, C thermocouple ◆ Options ◆ - Recorder - Turbo molecular pump - Crucible ◆ Main Applications ◆ - New material development - Fuel cells - Others
31~45 item / All 45 items
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Sputtering and deposition source hybrid thin film device [nanoPVD-ST15A]
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
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Vacuum Furnace "Mini-BENCH Ultra-High Temperature Tabletop Experimental Furnace"
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
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Vacuum Furnace "Mini-BENCH-prism Ultra-High Temperature Experimental Furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
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Annealing furnace "ANNEAL wafer annealing device"
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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Sputtering device "MiniLab series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
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Sputtering device "MiniLab-060"
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
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Vacuum Deposition Device "MiniLab-080"
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
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Sputtering device 'nanoPVD-S10A'
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
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Vacuum deposition device 'MiniLab-090' (for glove box)
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
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Vacuum Deposition Device "MiniLab Series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
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Vacuum Deposition Device "nanoPVD-T15A"
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
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Sputtering device 'MiniLab-026'
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
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Vacuum Deposition Device "MiniLab-026"
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
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Annealing furnace "Mini-BENCH-prism ultra-high temperature experimental furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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