All products and services
1～30 item / All 31 items
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FWM8612 High-Speed Wavelength Meter
1kHz ultra-fast, real-time wavelength monitoring
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Semight 1.6T Next-Generation Optical Communication Test Solution <Exhibition>
To everyone in charge of next-generation optical communication evaluation, we would like to introduce cutting-edge test solutions that meet industry needs! Information about our exhibition at COMNEXT2025.
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S2035H High Precision Source Measure Unit (Benchtop Type)
±200V × 1fA × 1Msps. Everything for development and evaluation measured with a single unit.
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WAT6600 Wafer Acceptance Test
Simultaneous measurement of 48 pins with an accuracy of 1 pA. Maximizing throughput with parallel measurements.
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PB6800 SiC KGD die handler
Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.
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S2019C PXIe Source Measure Unit (SMU)
4-channel, high resolution, high-speed sampling — PXIe SMU supporting a variety of devices and applications.
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BI6201 – Laser Diode Burn-In System
4224ch simultaneous burn-in, maximizing efficiency of LD reliability testing.
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CT8201 LD chip compatible normal temperature and high temperature die tester
One unit compatible with LIV·EA·spectrum — fully automatic, ultra-high efficiency tester, essential for mass production.
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sCT9002 Silicon Photonics Wafer Test System
A smart test system optimized for mass production screening of silicon photonics.
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PBT3058 1.6T Bit Error Rate Tester
From 1.6T optical modules to CPO and SiPh, everything for BERT evaluation in one device.
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CR3302 120GBd High-Speed Clock Recovery Unit
120GBd compatible clock extraction - An essential partner for next-generation PAM4/NRZ measurement.
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DCA1065 Sampling Oscilloscope
Semight DCA1065 Sampling Oscilloscope — Fully meets the testing needs of the 1.6T optical module!
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High Voltage Semiconductor Pulse Generation Unit
Generates sharp edges of ±40V / 1000V/μs, compatible with NVM, MEMS, and mid-power device testing! PXIe-compatible high-voltage pulse source unit.
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Polycrystalline super high thermal conductivity diamond substrate
High-output electronics, laser cooling, heat dissipation management, etc.
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Single crystal super high thermal conductivity diamond substrate
Highest grade thermal conductivity
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Polycrystalline ultra-high thermal conductivity optical grade diamond substrate
Multi-crystal ultra-high thermal conductivity optical grade wafer/sheet
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Polycrystalline super high thermal conductivity optical grade diamond substrate
Optimal for laser output windows, etc.
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Wafer-Level Burn-In for Various Devices and Components
Protect each circuit with complete hardware! Supports simultaneous burn-in of up to 20 wafers.
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Burn-in device (for devices, chips, and components)
Significant increase in production efficiency! You can freely set burn-in conditions for each jig, making it convenient for research and development.
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Pulse current compatible SMU
Pulse current source / Measurement and high-voltage semiconductor pulse source 2 models
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S3030F 3500V High Voltage Source Measurement Unit
±3500V, 10fA resolution - Stable measurement even at ultra-high voltage, ideal for evaluating power devices and SiC/GaN composite materials.
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High-Resolution Source Measurement Unit Series
High precision × multi-channel × fast response from 1fA/1μV — The ideal device for research and mass production.
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Standard tabletop source meter
Single channel and double channel two models
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PXIe High-Precision Source Measure Unit (SMU)
PXIe-Compatible High-Precision Source Measure Unit (SMU) Module Series | Semight Instruments
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Power device "KGD"
Full testing at low cost! The sealed structure of the probe ensures the safety and reliability of the press.
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Power Device "Wafer-Level Burn-In"
Protect each circuit with complete hardware! Supports simultaneous burn-in of up to 6 wafers.
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Inspection equipment "High Power LD (Laser Diode) COC Tester"
Fully automated COC inspection equipment for high-power LD (laser diode)!
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High-power LD burn-in equipment
Independent control for each layer is possible! High-output laser heat dissipation with a water cooling system + TEC.
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Inspection equipment "LD (Laser Diode) Chip Tester"
Simultaneous inspection of 2pcs LD chips under different temperature conditions! Inspection equipment compatible with DFB, EML, EML + SOA, etc. LD chips.
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LD (Laser Diode) COC Inspection Device
The inspection jig is shared with the burn-in system! The direct inspection rate and inspection stability have significantly improved.
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