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[Analysis Case] Evaluation of Flux Cleaning Residue

We capture the minute and ultra-thin residue as an image.

In recent years, with the introduction of lead-free solder, the flux components have also been improved (with higher activity and heat resistance, etc.), leading to increased corrosiveness and a growing importance of residue issues. Therefore, the removal of flux is required. An analysis of foreign substances in the electrode parts of printed circuit boards using TOF-SIMS revealed the presence of flux components.

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Measurement method: TOF-SIMS Product field: Electronic components Analysis purpose: Composition evaluation, identification, composition distribution evaluation

[Analysis Case] Evaluation of Flux Cleaning Residue_C0079

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