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[Analysis Case] Structural Analysis of Polyimide Resin

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[Analysis Case] Structural Analysis of Polyimide Resin

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c0430.jpg

Structural analysis of polyimide resin is possible using thermal decomposition GC/MS method.

Polyimide resin is excellent in heat resistance, chemical resistance, and toughness, and also has high insulation properties, making it used in various applications, including insulation materials for electronic devices. However, due to its almost non-existent solvent solubility, the analytical methods for structural determination are limited. This case introduces an example of thermal decomposition GC/MS measurement of commercially available polyimide resin. Multiple thermal decomposition products reflecting the polymer structure were observed in high-boiling components with long retention times, demonstrating that this method is a powerful means for structural determination.

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Analysis of electronic components.

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[Analysis Case] Structural Analysis of Polyimide Resin_C0430

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