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[Analysis Case] Evaluation of Metal and Organic Contamination on Wafer Surface

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[Analysis Case] Evaluation of Metal and Organic Contamination on Wafer Surface

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Comprehensive evaluation based on the analysis results of multiple methods.

Foreign substances attached to manufacturing equipment or parts can affect product defects and equipment operation issues. By properly analyzing and evaluating these foreign substances, we can investigate the causes of their occurrence and improve the defects. This document presents a case study of the complex analysis of contamination attached to the surface of Si wafers using ICP-MS and SWA-GC/MS. SWA (Silicon Wafer Analyzer) -GC/MS is a method that heats the wafer in an electric furnace to gasify organic substances, which are then measured using GC/MS.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/45…

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Analysis of manufacturing equipment and components.

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