[Analysis Case] Evaluation of Internal State of Transistor
We evaluate abnormalities inside the device non-destructively.
In order to investigate the causes of device failures that cannot be identified through visual inspection, non-destructive evaluation methods such as X-ray CT may be necessary. Using X-ray CT, we measured the faulty transistor and checked its internal condition. As a result, we confirmed a wire breakage, and it was also found that the mold resin surrounding the broken wire had deteriorated due to heat and other effects at the time of the breakage.
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Applications/Examples of results
Analysis of electronic components.