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[Analysis Case] TDS Analysis of Epoxy Resin

C0568_エポキシ樹脂のTDS分析.jpg

[Analysis Case] TDS Analysis of Epoxy Resin

C0568_エポキシ樹脂のTDS分析.jpg
C0568_エポキシ樹脂のTDS分析.jpg

It is possible to investigate the degassing behavior of organic matter in a vacuum.

Epoxy resin is used as a semiconductor encapsulant, as well as an adhesive and for vacuum leak prevention both inside and outside vacuum devices. However, even after curing, heating may cause outgassing, which can negatively affect products and equipment. TDS (Thermal Desorption Gas Analysis) allows for monitoring outgassing components by heating the sample in high vacuum (1E-7 Pa) or while maintaining a constant temperature. Below, we present a case study investigating the outgassing behavior of epoxy resin using TDS with temperature maintenance.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/50…

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Analysis of manufacturing equipment and components.

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[Analysis Case] TDS Analysis of Epoxy Resin_C0568

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