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[Analysis Case] Simultaneous Heating Analysis of Copper Plates and Solder by TDS

C0569_TDSによる銅板・はんだ.jpg

[Analysis Case] Simultaneous Heating Analysis of Copper Plates and Solder by TDS

C0569_TDSによる銅板・はんだ.jpg
C0569_TDSによる銅板・はんだ.jpg

It is possible to evaluate degassing in an environment close to the actual process by bringing the materials into contact with each other.

Soldering of metals is one of the essential processes in the field of electronics. It is known that the outgassing that occurs when metal and solder are heated in contact can lead to voids. Below, we introduce a case where TDS analysis (Thermal Desorption Spectroscopy) was performed with solder placed on a copper plate. TDS can evaluate the outgassing associated with the heating of materials. By bringing the copper plate and solder into contact and heating them simultaneously within the TDS apparatus, we were able to capture outgassing in an environment close to the actual process.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/50…

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Analysis of electronic components, manufacturing equipment, and parts.

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[Analysis Case] Simultaneous Heating Analysis of Copper Plate and Solder by TDS_C0569

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