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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

C0536.jpg

[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

C0536.jpg
C0536.jpg

We will evaluate the internal structure of the device in a comprehensive manner.

MST offers a range of technologies suitable for evaluating the internal structures of electronic devices, and we propose analytical methods tailored to the observation field and objectives. This document presents case studies investigating specific areas of devices using X-ray CT and FIB-SEM. First, we observed the internal structure of the entire sample using X-ray CT to explore specific areas. Next, we used FIB-SEM to examine the detailed structures of the specific features identified on the vias.

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Analysis of electronic components.

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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM_C0536

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!

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