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[Analysis Case] Investigation of Foreign Object Occurrence: Analysis of the Tube

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[Analysis Case] Investigation of Foreign Object Occurrence: Analysis of the Tube

img_C0740_1.jpg
img_C0740_1.jpg img_C0740_2.jpg img_C0740_3.jpg

It is possible to estimate the cause of wafer contamination!

TOF-SIMS is a very effective method for investigating the causes of contamination due to foreign substances, deposits, dirt, discoloration, and other factors related to the process. By comparing the mass spectral information obtained from contamination such as foreign substances with the mass spectral information of candidate contamination source components, it is possible to infer the sources of that contamination. In this document, we prepared four types of resin tubes used in the wafer manufacturing process and foreign substances on Si wafers, and by comparing their mass spectral information, we evaluated which components used in the process the contamination from the foreign substances was attributed to.

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Measurement method: TOF-SIMS Product fields: Electronic components, manufacturing equipment and parts, daily necessities Analysis purpose: Impurity evaluation and distribution assessment

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Analysis of electronic components, manufacturing equipment and parts, and daily necessities.

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[Analysis Case] Investigation of Foreign Matter Occurrence: Tube Analysis_C0740

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