[Analysis Case] TOF-SIMS Analysis of Solder Separation Cross Section
It is possible to evaluate the distribution of inorganic and organic substances in microdomains.
To investigate the causes of solder delamination, it is effective to conduct component analysis of the solder and the substrate interface. TOF-SIMS is a suitable method for evaluating delaminated areas because it can simultaneously analyze elemental composition and molecular information of organic and inorganic substances, as well as perform imaging analysis. This document presents a case study analyzing the cross-section of a delaminated solder area, confirming the distribution of substrate components, resin components, and organic components other than resin.
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Measurement method: TOF-SIMS Product field: LSI, memory, electronic components Analysis purpose: Failure analysis, defect analysis
