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[Analysis Case] Investigation of Causes of Peeling in Plating and Coating

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[Analysis Case] Investigation of Causes of Peeling in Plating and Coating

Identification of contamination sources on the cleavage surface using TOF-SIMS.

When delamination occurs, it is important to identify the components that have worsened the adhesion at the interface. By using a peeling process to physically delaminate at the interface of interest and measuring the components present on that surface with TOF-SIMS, it is possible to investigate the cause of delamination. TOF-SIMS detects secondary ions that are ionized while maintaining the structure of organic materials, allowing us to obtain information about the origin of the components present at the delamination surface, making it effective for investigating the causes of delamination and the process. Measurement methods: TOF-SIMS, peeling, disassembly Product fields: LSI, memory, manufacturing equipment, components Analysis purposes: Evaluation of chemical bonding states, failure analysis, defect analysis For more details, please download the materials or contact us.

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Analysis of chemical bonding state evaluation, failure analysis, and defect analysis.

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[Analysis Case] Investigation of Causes of Peeling in Plating and Coating, etc. C0198

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