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[Analysis Case] Analysis of Microscopic Contaminants on Wafer Surface

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[Analysis Case] Analysis of Microscopic Contaminants on Wafer Surface

Composition analysis of 30nm size is possible without processing.

AES analysis is a method for obtaining compositional information from the surface down to a depth of several nanometers, and it is an effective analysis for investigating the composition of contaminants and foreign substances that occur on the surface during the manufacturing process. Since it rarely detects information about the substrate or base material, it allows for a simple examination of only the abnormal areas, such as foreign substances, without preprocessing. Additionally, by conducting surface analysis, it is possible to obtain elemental distribution images. In this case study, we will present data evaluated using AES analysis regarding foreign substances present on a Si wafer.

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Analysis of LSI, memory, electronic components, manufacturing equipment, and parts.

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[Analysis Case] Analysis of Microscopic Foreign Substances on Wafer Surface_C0334

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