[Analysis Case] Evaluation of the Fracture Surface of Laminated Samples by AES Analysis
Visualizing a 50nm thin film with a cross-sectional sample.
AES analysis is a method for obtaining compositional information from the surface to a depth of several nanometers. By performing AES measurements on the cross-section of a sample to obtain elemental distribution images, it is possible to clearly evaluate the layered structure. In addition to evaluating layered structures and conducting elemental analysis of the inner walls of trenches and holes, combining mechanical processing and ion beam processing allows for the assessment of thin alloy layers and phenomena such as diffusion and segregation of elements. In this case, we will present data evaluated using AES analysis for a thin film deposited on a silicon substrate.
basic information
For detailed data, please refer to the catalog.
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Applications/Examples of results
Analysis of LSI, memory, electronic components, manufacturing equipment, and parts.