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[Analysis Case] Degassing Evaluation of Plating Samples

Thermal Desorption Gas Analysis of Ni/Au Plating (TDS)

If the plating film contains gas, it may cause defects such as peeling, blistering, and bubbles within the film. To investigate the gas contained in the plating film, TDS, which can measure the gas released by heating the sample in a high vacuum, is effective. The results of TDS analysis on a sample with Ni/Au plating on SUS material are presented. The release of H2, HCN, H2S, and HCl from the plating film was confirmed. Additionally, quantitative values were calculated.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/38…

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Analysis of LSI and memory.

[Analysis Case] Degassing Evaluation of Plating Sample_C0464

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