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[Analysis Case] Analysis of the adhesive sheet components of the wafer

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[Analysis Case] Analysis of the adhesive sheet components of the wafer

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c0501.jpg

Evaluation of organic pollution's qualitative, quantitative, and distribution aspects using a combination of multiple methods.

In the manufacturing process of semiconductor devices, various adhesive sheets, such as dicing tape, are used. Adhesive sheets can be a source of foreign substances and contamination. Therefore, in this case study, we will present the results of a comprehensive evaluation using TOF-SIMS and SWA-GC/MS. With TOF-SIMS, by conducting qualitative analysis of each adhesive sheet material, it is possible to identify which adhesive sheet is responsible for foreign substances and contamination, as well as which layer of the adhesive sheet is the source. Additionally, SWA-GC/MS allows for quantitative confirmation of which adhesive sheet has the least contamination.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/43…

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Analysis of LSI, memory, and power devices.

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[Analysis Case] Analysis of Wafer Adhesive Sheet Components_C0501

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