[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM
Reverse engineering of DRAM on the product's internal substrate.
We will conduct a comprehensive analysis of DRAM, a representative memory, from product level to device microstructure analysis through TEM observation. By performing appearance observation, layer analysis, and Slice & View, we will grasp the overall structure, control the FIB processing position at the nanoscale, and observe the microstructure of the memory section through TEM imaging after thin section formation.
basic information
For detailed data, please refer to the catalog.
Price information
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Delivery Time
Applications/Examples of results
Analysis of LSI and memory.