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[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM

c0542.jpg

[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM

c0542.jpg
c0542.jpg

Reverse engineering of DRAM on the product's internal substrate.

We will conduct a comprehensive analysis of DRAM, a representative memory, from product level to device microstructure analysis through TEM observation. By performing appearance observation, layer analysis, and Slice & View, we will grasp the overall structure, control the FIB processing position at the nanoscale, and observe the microstructure of the memory section through TEM imaging after thin section formation.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/49…

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For detailed data, please refer to the catalog.

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Applications/Examples of results

Analysis of LSI and memory.

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[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM_C0542

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!

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