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[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM

Reverse engineering of DRAM on the product's internal substrate.

We will conduct a comprehensive analysis of DRAM, a representative memory, from product level to device microstructure analysis through TEM observation. By performing appearance observation, layer analysis, and Slice & View, we will grasp the overall structure, control the FIB processing position at the nanoscale, and observe the microstructure of the memory section through TEM imaging after thin section formation.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/49…

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Applications/Examples of results

Analysis of LSI and memory.

[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM_C0542

TECHNICAL

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