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[Analysis Case] Composition Analysis of Particles on a Wafer

img_C0736_2.jpg

[Analysis Case] Composition Analysis of Particles on a Wafer

img_C0736_2.jpg
img_C0736_2.jpg

Shape observation and simple quantitative analysis using SEM-EDX.

Control of particles in the semiconductor wafer manufacturing process is extremely important for ensuring wafer quality. In this case study, we estimated what the particles were on a Si wafer through SEM observation, EDX analysis, and simple quantification. The SEM equipment, which has high spatial resolution in the submicron range and can scan areas of several centimeters, allows for rapid inference of what the particles on the wafer are based on shape and composition information, enabling quick identification of the generation process. Analysis linked to coordinate data from defect inspection equipment is also possible.

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Measurement and processing method: [SEM-EDX] Energy Dispersive X-ray Spectroscopy (SEM) Product fields: LSI, memory, manufacturing equipment, and components Analysis purpose: Composition evaluation and identification, shape evaluation

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Analysis of LSI memory, manufacturing equipment, and components.

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[Analysis Case] Composition Analysis of Particles on Wafer_C0736

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