[Analysis Case] SEM Observation of Wide-Area Cross-Section Using Xe-PFIB
Observation of cross-sections with an accuracy of several tens of nanometers and a size of several hundred micrometers is possible!
We offer wide-area cross-sectional SEM observation (C0610) using Xe-PFIB. The metal bonding that electrically connects the electrodes of integrated circuits, electrodes, printed circuit boards, and semiconductor packages has a diameter of several tens of μm to several hundred μm. With Xe-PFIB (Xe-Plasma Focused Ion Beam), we can target processing positions on the order of several tens of nm and create cross-sections of several hundred μm square, allowing for a detailed understanding of the entire view at the center of the bonding. 【Measurement and Processing Methods】 ■ [SEM] Scanning Electron Microscopy ■ X-ray CT Method ■ [FIB] Focused Ion Beam Processing *For more details, please download the PDF or feel free to contact us.
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【Product Field】 ■LSI・Memory *For more details, please download the PDF or feel free to contact us.
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【Analysis Objectives】 ■Shape Evaluation ■Structural Evaluation ■Product Investigation *For more details, please download the PDF or feel free to contact us.
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!