Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

最終更新日 Jul 29, 2024

Technical Data: Fully Automated Implementation of High-Power Laser Diodes

Detailed information on fully automated implementation of high-output laser diodes.

最終更新日 Dec 16, 2021

High-precision flip chip bonder: lambda2

The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.

最終更新日 Jan 26, 2024

High-precision, high-function flip chip bonder: sigma

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

最終更新日 Sep 11, 2023

High-precision full-auto flip chip bonder: femto2

The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.

最終更新日 Aug 18, 2021

Full Auto Flip Chip Bonder: femto blu

The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.

最終更新日 Aug 18, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

最終更新日 Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

最終更新日 Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

最終更新日 Nov 01, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

最終更新日 Nov 01, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

最終更新日 Aug 06, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

最終更新日 Aug 06, 2021

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

最終更新日 Jul 28, 2021

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

最終更新日 May 28, 2020

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

最終更新日 May 28, 2020

[Customer Case] Brain Implant Offers New Hope for Epilepsy Patients

Continuously monitor brain waves through embedded electrodes! Provide stimulation at precise timings.

最終更新日 Jul 02, 2021

[Customer Case] Provides direction and important information at a glance!

Contributing to the maintenance of a timely flow of information.

最終更新日 Jul 02, 2021

[Customer Case] High-Power Semiconductor Laser Assembly for Mars Rover

Investigating the geology and climate of Mars! Assembled with a precision die bonder made by Finetech.

最終更新日 Jul 02, 2021

[Customer Case] Top-notch Equipment for Top-notch Research

It provides a foundation for critical thinking and scientific development for scholars and experts.

最終更新日 Jul 02, 2021

[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips

We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!

最終更新日 Jul 02, 2021

[Customer Case] Utilization of High-Precision Die Bonder

We provide advanced research facilities for microsystem technology to our partners!

最終更新日 Jul 02, 2021

[Customer Case] Innovative Radiation Detection Device Prototype Assembly to Mass Production

This is an introduction to a case where the assembly device was able to meet the conditions necessary for growth.

最終更新日 Jul 02, 2021

[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

Bonding position accuracy of 0.5µm!

最終更新日 Jul 01, 2021

[Application Example] 3D Mounting with High-Precision Die Bonder

Submicron positional accuracy! High bonding load up to 1000N!

最終更新日 Jul 01, 2021

[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

Multiple processes with a single device! Bonding position accuracy of 0.5µm!

最終更新日 Jul 01, 2021

[Use Case] High-precision assembly due to high optical resolution

Achieved an optical resolution of 0.7µm!

最終更新日 Jul 01, 2021

[Use Case] Implementation and Packaging of Optical Communication Devices

From prototype development to mass production! Ensuring high yield with manufacturing technology.

最終更新日 Jul 01, 2021

[Blog] Joining Materials and Joining Methods

We realize that our Daibonder has very high versatility! An explanation of bonding materials and bonding methods.

最終更新日 Jul 02, 2021

[Blog] Laser Assistance and Laser Bonding

Using a laser as a heat source: How does it affect bonding?

最終更新日 Jul 02, 2021

[Blog] LiDAR is everywhere!

Introduction to autonomous driving technology and mapping! There are many technologies that can utilize LiDAR.

最終更新日 Jul 02, 2021