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Accelerating research and development, [new] surface analysis service launched!

イプロス20250707_GENESISA-02.jpg
イプロス20250707_GENESISA-02.jpg

Accelerating research and development, [new] surface analysis service launched!

Not only the surface, but also up to a depth of 30nm - Quantitative evaluation of the chemical state at the surface and inside the material at the same location and non-destructively!

We have launched a new service using XPS/HAXPES starting in June! For increasingly complex materials and fine structure samples, we can evaluate the composition and chemical bonding states from the surface to the interior of the material (up to ~30nm) at the same location and in a non-destructive manner. - Depending on the elements of interest and the analysis area and depth, we can select the appropriate X-ray source (Al Kα/Mg Kα/Ga Kα/Cr Kα) to achieve evaluation under suitable measurement conditions. - Non-exposure measurements to the atmosphere, Ar monomer/GCIB sputter etching, and heating pretreatment can be combined. - It is possible to evaluate the electronic states of semiconductor samples using UPS/LEIPS (ionization potential/electron affinity/band gap).

MST HP

basic information

In recent years, we have been able to respond to the increasing demand for "quantitative evaluation" of deep regions and "analysis of the bonding state of fine structure samples." By introducing a new Cr line in addition to the conventional Al, Mg, and Ga lines, we have narrowed down the measurement locations while expanding the maximum measurable depth to 30 nm. This allows for evaluation of deep regions even with small spots. Additionally, a significant feature is that XPS (surface analysis) and HAXPES (deep analysis) can be measured at the same location without positional deviation.

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Applications/Examples of results

- Evaluation of the composition/bonding state of semiconductor thin film surfaces and interfaces - Evaluation of the composition/bonding state of secondary battery material surfaces and bulk - Evaluation of the composition/bonding state of core-shell type nanoparticles - Evaluation of the depth distribution of the composition/bonding state of organic films - Evaluation of the band gap of semiconductor thin films

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Evaluation avoiding duplication of OGP peak by HAXPES_B0273

TECHNICAL

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[Analysis Case] Evaluation of Binding State of Secondary Battery Cathode_C0659

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