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[Analysis Case] Binding State Mapping by XPS

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[Analysis Case] Binding State Mapping by XPS

It is possible to evaluate the distribution of surface contamination and surface treatment on samples with mm-order precision.

This document presents an example of evaluating organic contamination through bonding state mapping using XPS. This bonding state mapping is obtained by acquiring XPS spectra of the element of interest at several hundred points within the plane and plotting the distribution of peak intensities corresponding to the energy positions of specific bonding states. Depending on the size of the area of interest, evaluation areas can be set to arbitrary sizes ranging from approximately 1mm to 20mm square, making it particularly suitable for assessing contamination, discoloration, and surface treatments on the order of millimeters. Similar evaluations can also be conducted for metals and silicon, in addition to carbon.

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Measurement Method: XPS Product Field: Electronic Components, Manufacturing Equipment, Parts, Daily Goods Analysis Purpose: Bonding State Evaluation

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Analysis of electronic components, manufacturing equipment, parts, and daily necessities.

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[Analysis Case] Binding State Mapping by XPS_C0592

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