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[Slice&View] Three-Dimensional SEM Observation Method

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[Slice&View] Three-Dimensional SEM Observation Method

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A0045.jpg 打ち合わせ.jpg セミナー.jpg

By repeatedly performing cross-sectioning processing with FIB and observation with SEM, and reconstructing the obtained images, three-dimensional structural information can be obtained.

Using a high-resolution SEM device equipped with FIB, we can obtain three-dimensional structural information by repeatedly performing cross-sectioning (Slice) with FIB and observing (View) with SEM, and then reconstructing the acquired images. Similarly, Slice & View is also possible for SIM (Scanning Ion Microscope) images. - It is possible to observe secondary electron (SE), backscattered electron (BSE) images, and scanning ion microscope (SIM) images.

Related Link - https://www.mst.or.jp/method/tabid/143/Default.asp…

basic information

By repeatedly performing cross-sectional processing with FIB and observing with SEM, continuous SEM observation results can be obtained. By integrating SEM data on software, it is possible to obtain a three-dimensional constructed image.

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Applications/Examples of results

- Three-dimensional shape evaluation of semiconductor devices - Investigation of voids and disconnections in metal wiring after reliability testing - Evaluation of pattern misalignment - Assessment of the embedment of interlayer films - Investigation of the generation process of foreign substances within multilayer structures - Evaluation of the contact area of contacts - Three-dimensional evaluation of thin film coverage - Shape evaluation of seams within W contacts - Observation of the shape of pits in optical disc recording layers - Roughness evaluation of laminated structure interfaces

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