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Differential Scanning Calorimetry (DSC)

DSC can evaluate the physical properties of a sample based on the heat changes that occur during heating.

DSC can evaluate the physical properties of a sample based on the heat changes that occur during heating. - It can confirm melting point, crystallization temperature, glass transition temperature, Curie point, specific heat, and more. - It can be applied to measure crystallinity, purity, reaction rate, and crystallization rate. - Measurements can be taken below the freezing point, allowing for the evaluation of free water and bound water.

Related Link - https://www.mst.or.jp/method/tabid/166/Default.asp…

basic information

The heat flux DSC continuously records the temperature difference when the reference material and the sample are heated simultaneously. From this, information such as the temperature and heat quantity of transitions and reactions, as well as heat capacity, can be obtained. The key difference from DTA is that this temperature difference is designed to be proportional to the difference in heat energy input per unit time. As the temperature of the electric furnace (heater block) is increased at a constant rate, the reference sample and the measurement sample also rise at the same rate. If an endothermic reaction occurs in the measurement sample at this time, the temperature increase of the measurement sample stops while the reaction is taking place, resulting in a temperature difference (ΔT) between the measurement sample and the reference sample. This temperature difference is relaxed by the heat flow through the sensing plate, but during this time, the heat quantity (heat flow) entering the sample per unit time is proportional to the temperature difference between the sample and the reference material. Therefore, by integrating the temperature difference (ΔT) over time, the heat quantity of the reaction can be determined. In addition to the heat flux type, there is also an input compensation type.

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Applications/Examples of results

■Structural changes due to heating Rubber Film Adhesives Biopolymers Metals Ceramics Lithium-ion secondary battery materials, etc.

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