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[Analysis Case] Elemental Analysis of Wire Bonding Interface

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[Analysis Case] Elemental Analysis of Wire Bonding Interface

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c0486.jpg

By using a combination of processing, elemental analysis of the interface is possible.

AES analysis is a method for obtaining compositional information and elemental distribution at the very surface (to a depth of a few nanometers). By combining it with cross-sectional processing, similar information can also be obtained within layered structures and at structural interfaces. This allows for the evaluation of alloy layers, elemental diffusion, and segregation, making it effective for failure analysis and defect investigation of devices. Below, we present a case where a cross-section was prepared using IP processing to evaluate the state near the bonding interface of wire bonding, followed by assessment through AES analysis.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/42…

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Analysis of LSI, memory, and electronic components.

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[Analysis Case] Element Analysis of Wire Bonding Interface_C0486

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