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[Analysis Case] Structural Analysis of Positive-Type Photoresist

Structural analysis of photosensitizers is possible using thermal decomposition GC/MS method.

Positive-type photoresists are widely used as photolithography materials in semiconductor device manufacturing. The materials used in the resist vary significantly depending on the exposure light source, but for g-line and i-line resists, phenolic novolak resin is generally used as the base resin, and naphthoquinone diazide compounds are used as the photosensitizer. This case study introduces an example where naphthoquinone diazide compounds were decomposed using thermal decomposition GC/MS method to estimate the structure of the parent nucleus.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/43…

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Analysis of electronic components.

[Analysis Case] Structural Analysis of Positive Photoresist_C0504

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