Announcement of the Start of Non-Destructive Testing Services from April 2018

We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.

On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control for electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal state of a product without destroying it. Until now, MST has primarily offered contract services based on destructive analysis methods such as electron microscopy and mass spectrometry. However, there has been an increasing customer demand for observing electronic devices without destruction in recent years. Additionally, there has been a growing need in other fields as well, such as confirming the shapes of pharmaceutical and medical device components, observing the distribution of constituent materials within food, and checking for the presence of cavities. With the introduction of the latest processing and analysis equipment, MST is now able to conduct non-destructive analysis. We will provide analysis services on a contract basis.

Announcement of the Start of Non-Destructive Analysis Services on the MST Website

basic information

We will introduce processing and analysis equipment and start a non-destructive analysis contract service. ● X-ray CT By irradiating the sample with X-rays, we obtain two-dimensional transmission images of the internal structure. From continuous imaging data of the rotating sample, we generate three-dimensional CT images. This method is effective not only for metal materials but also for organic materials such as resins and carbon materials. ● Ultrasonic Microscope Ultrasound is irradiated onto the sample, and the reflected waves are detected. Since ultrasound causes strong reflections at air layers, it allows for the observation of internal voids and cracks in the sample. ● Laser Processing Machine This is the first model introduced in Japan (*). It has a processing speed that is 10,000 times faster than FIB. By removing unnecessary parts that are not the focus of the X-ray CT sample, we can eliminate unwanted reflections and obtain clear CT images. * According to a survey by Nanotech Solutions Co., Ltd. (as of March 2018).

Price information

Prices may vary depending on the analysis conditions, so please feel free to contact us.

Delivery Time

Please contact us for details

Applications/Examples of results

● Electronic Device Related - Analysis of internal voids, cracks, and foreign substances in semiconductor packages - Investigation of solder delamination in BGA mounted products - Investigation of porosity within resin - Investigation of the shape of laser holes ● Automotive Parts and Battery Related - Observation/analysis of weld joints such as in the body - Failure analysis of small Li-ion batteries - Observation of filler dispersion within resin - Observation of fiber orientation in resin molded products ● Pharmaceuticals and Medical Devices Related - Coating investigation of tablets - Analysis of cracks, voids, and pores inside tablets - Investigation of inner diameter of catheters, etc.