[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages
Non-destructive three-dimensional observation of the internal structure of a discrete package.
In investigations of competitor products and inspections of defective items, an internal structural examination is necessary first. X-ray CT allows for non-destructive acquisition of transmission images from within the sample, enabling three-dimensional reconstruction. This document presents a case study where a discrete package equipped with SiC chips was observed using X-ray CT as part of a product investigation. After confirming the structure with X-ray CT, we propose conducting physical analysis (failure analysis) using MST.
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Measurement Method: X-ray CT Method Product Field: Power Devices Analysis Purpose: Shape Evaluation, Product Investigation, Deterioration Investigation, Reliability Evaluation, Structural Evaluation
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