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[Analysis Case] Evaluation of Gold Thin Film Adhesion on Wafer by XRF

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[Analysis Case] Evaluation of Gold Thin Film Adhesion on Wafer by XRF

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Comparison of the amount of thin film components adhered between samples.

In fluorescent X-ray analysis (XRF), a simple evaluation of elemental distribution is possible. In this case study, we used a deposition device to create films of arbitrary amounts of Au on 4-inch Si wafers A and B as samples, and compared the distribution and total amount of Au. The results of the surface analysis confirmed the distribution state of Au (Figures 1-4). Additionally, by comparing the adhesion amounts based on the Au intensity from the XRF spectra obtained from each pixel, we confirmed that wafer B had more Au than wafer A (Figure 5).

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/41…

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[Analysis Case] Evaluation of Gold Thin Film Adhesion on Wafer by XRF_C0479

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