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[Analysis Case] In-plane film thickness evaluation of Au thin film on wafer using XRF.

c0480.jpg

[Analysis Case] In-plane film thickness evaluation of Au thin film on wafer using XRF.

c0480.jpg
c0480.jpg

Visualization of film thickness distribution through multi-point mapping measurement.

In fluorescent X-ray analysis (XRF), it is possible to easily evaluate element distribution and film thickness. In this case study, we will introduce an example of evaluating the thickness distribution of an Au film on a 4-inch Si wafer through multi-point mapping measurements. By performing multi-point mapping, we can calculate the Au film thickness using the FP (Fundamental Parameter) method from the XRF spectra at each point, allowing for the evaluation of thickness distribution based on the measurement coordinates.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/41…

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Analysis of power devices, lighting, manufacturing equipment, and components.

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[Analysis Case] In-plane film thickness evaluation of Au thin film on wafer using XRF_C0480

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