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[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages

C0554.jpg
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[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages

C0554.jpg
C0554.jpg サンプル内部構造.png サンプル全景.png サンプル外観.png X線透過像.png 開封後のサンプル内部構造.png

Non-destructive three-dimensional observation of the internal structure of a discrete package.

In investigations of competitor products and inspections of defective items, an internal structural examination is necessary first. X-ray CT allows for non-destructive acquisition of transmission images from within the sample, enabling three-dimensional reconstruction. This document presents a case study where a discrete package equipped with SiC chips was observed using X-ray CT as part of a product investigation. After confirming the structure with X-ray CT, we propose conducting physical analysis (failure analysis) using MST.

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Measurement Method: X-ray CT Method Product Field: Power Devices Analysis Purpose: Shape Evaluation, Product Investigation, Deterioration Investigation, Reliability Evaluation, Structural Evaluation

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[Analysis Case] Non-destructive 3D Structural Observation of SiC Trench MOSFET Discrete Package_C0554

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