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Transient thermal resistance measurement

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Transient thermal resistance measurement

img_a0083.jpg
img_a0083.jpg

Transient Thermal Resistance Measurement

- The transient thermal resistance value (Rthjc) of power devices, heat dissipation substrates, etc., will be measured based on JESD51-14. - If it is a power device, testing can be conducted with the actual device as is. When testing heat dissipation substrates, it is necessary to mount various semiconductor chips as heat sources. - We also support the prototyping of test devices, and evaluation can be conducted even with individual components provided.

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Applications/Examples of results

- Evaluation of the thermal resistance Rthjc of power devices - Evaluation of the transient thermal resistance of heat dissipation substrates - Performance evaluation of TIM materials *Testing conditions can be adjusted according to various requests, please consult with us.

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!

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