All products and services
1～30 item / All 87 items
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Vacuum valve
A design that allows for a large conductance during disk opening, making it difficult to compromise the exhaust speed of a vacuum pump with low leakage.
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Achieving surface treatment close to vacuum RIE under atmospheric pressure! Atmospheric pressure plasma system.
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
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Large substrate compatible equipment (film formation, etching, annealing)
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
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Multi-purpose sputtering device for surface treatment, model STV6301.
A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.
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Plasma Lava Coating Device (STV6301 Sputtering Device)
Coating Sakurajima lava with the latest plasma technology. Naturally derived functional surface treatment. Achieving new functions such as various vegetation and hydrophilicity for all types of equipment.
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Vacuum soldering device (vacuum reflow device)
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
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300mm substrate compatible load-lock sputtering system
This is a device that supports the automatic transport of large substrates and can be applied from research and development to mass production. We will design it to meet your company's requirements.
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Cu etching compatible high-density plasma etching device
Equipped with a new plasma source HCD (hollow cathode discharge) electrode, capable of etching various metals and Cu thin films. A new type of etching device that also facilitates large-area processing.
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Metal nanopaste sintering bonding compatible vacuum soldering device
A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.
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Large plasma etching device
Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.
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Hydrogen-free DLC coating device (high-density sputtering ADMS device)
Forming hydrogen-free DLC films (hydrogen content below 1%) with unique technology, exhibiting excellent tribological properties in oil, and compatible with conductive carbon thin films.
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Hydrogen Plasma Cleaning Device (Ion Cleaning Type)
H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)
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ALN coating device (high-density plasma sputtering ADMS device)
Forming crystalline AlN films with high-density plasma sputtering, compatible with full coating on three-dimensional shapes. Fully automated mass production equipment lineup.
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Atmospheric non-exposure multi-sputtering device
Sulfur compound compatibility available. Dedicated film deposition device for research on thin-film solid-state batteries. Comprehensive support from target to film deposition testing, including dedicated equipment. Standard glove box included.
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R&D Multi-Chamber Sputtering Device
Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.
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HCD type high-density plasma etching device
Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.
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Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
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Ion plating device for side electrodes (compatible with surface-mounted small components)
Dry formation of side electrodes for small electronic components (surface mount type). End face electrode deposition compatible with small components made possible by PVD (ion plating equipment).
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Conductive carbon thin film formation device (arc discharge sputtering device)
Conductive carbon thin films are formed by sputtering. Stable film formation is achieved through a simple process with inert gas and carbon target at low temperatures (below 400°C).
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Horizontal hydrogen annealing device (variable atmosphere heat treatment device)
Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).
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SiC coating device (AF-IP device)
A dense SiC (silicon carbide) film with excellent wear resistance and oxidation resistance is formed using PVD. A thick film (7 μm) is formed using a new ion plating method.
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Dry vacuum pump for the chemical industry
A tough dry vacuum pump suitable for replacement of water-sealed vacuum pumps.
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Vacuum exhaust system for CVD equipment (chlorine gas compatible vacuum pump unit)
Proven track record in exhaust for hot CVD equipment. Particularly effective for the exhaust of Cl-based gases, achieving both high-volume exhaust and compatibility with chlorine-based gases. A reliable system that also incorporates gas treatment.
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Water-sealed vacuum pump (made of stainless steel) for the chemical industry
Stainless steel (equivalent to SUS316) water-sealed vacuum pump suitable for corrosive gases.
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Dry pump (dry vacuum pump) for vacuum sintering furnace
The best dry pump for replacing an oil rotary vacuum pump.
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Vacuum heat treatment device (hot plate type)
A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.
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Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)
A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.
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Sealed liquid circulation type water-sealed vacuum pump SW-S/AS-C series
Liquid-sealed vacuum pump with a circulation system to prevent the leakage of harmful substances.
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Compound semiconductor deposition device (AAMF-C1650SPB type)
A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.
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Hard film sputtering device STL5521 type (for precision lens molds)
Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.
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