◉ Hot stage "Substrate heating mechanism" Max 1800℃
◉ Hot stage "Substrate heating mechanism" Max 1800℃
◉ Substrate up and down mechanism, rotation, RF/DC bias, tilt ◉ Compatible sizes: φ2inch to φ4inch ◉ Operating atmosphere: O2, N2, Ar, Vac, etc. ◉ Maximum operating temperature: - Max 1800℃ (Gr, CCC, CCC/PG) - Max 1600℃ (Graphite + SiC coating, PBN coating) - Max 850℃ (NiCr) - Max 1000℃ (Kanthal)
1～30 item / All 39 items
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Thin Film Experimental Device - "PRODUCTS GUIDE 2022"
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
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[Hot Stage] Ultra High Temperature Substrate Heating Stage Max 1800℃
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
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BH Series [High-Temperature Thin Film Experiment Substrate Heating Heater] Max 1800℃
This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.
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[SH High-Temperature Substrate Heater] For PVD, CVD Max 1100℃
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
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◾️Vacuum use 【CH ultra-high temperature cylindrical heater】 Max 1800℃ ◾️
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800°C (Graphite, C/C Composite)
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◆ANNEAL◆ Wafer Annealing Equipment
Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃
Tabletop small-sized experimental furnace - space-saving, with a maximum operating temperature of 2000°C! We also manufacture metal furnaces for reducing atmospheres.
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TCF-C500 Ultra-High Temperature Small Experimental Furnace Max 2900℃
Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.
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MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2000℃
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.
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◆◇◆ Small Vertical Experimental Furnace for R&D TVF-110 ◆◇◆
Low-cost minimum necessary configuration (manual control) applicable as tubular furnace, diffusion furnace, and thermal CVD.
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Products Guide: "Ultra-High Temperature Experimental Furnace Product Guide"
Introducing the Thermocera Japan research and development experimental furnace. It can be utilized for material development such as fuel cells and ceramics, as well as ultra-high temperature experiments involving graphite and more.
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[Nanofurnace] BWS-NANO Thermal CVD Device
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
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nanoCVD-8G Graphene Synthesis Device
◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.
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Magnetron Sputtering Cathode
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
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【nanoPVD-S10A】Magnetron Sputtering Device
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
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◆nanoPVD-T15A◆ High-performance Organic and Metal Film Deposition Equipment
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
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□■□【MiniLab-026】Flexible Thin Film Experimental Device□■□
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
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□■□【MiniLab-060】Flexible Thin Film Experimental Device□■□
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
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MiniLab-026/090 Glove Box Thin Film Experiment Device
Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.
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MiniLab Series Flexible Thin Film Experiment Device
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
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Soft Etching Device [nanoETCH]
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
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□■□【MiniLab-080】Flexible Thin Film Experiment Device□■□
Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.
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□■□【MiniLab-090】Flexible Thin Film Experimental Device□■□
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
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◆Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace◆
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Sputtering and deposition source hybrid thin film device [nanoPVD-ST15A]
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
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Vacuum Furnace "Mini-BENCH Ultra-High Temperature Tabletop Experimental Furnace"
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
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Vacuum Furnace "Mini-BENCH-prism Ultra-High Temperature Experimental Furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
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Annealing furnace "ANNEAL wafer annealing device"
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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Sputtering device "MiniLab series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
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