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● MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2200℃

● MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2200℃

● MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2200℃

A dedicated R&D ultra-high temperature experimental furnace for "wafer baking" that emphasizes safety and operability. ◆ Main Features ◆ - Can be easily operated by anyone, regardless of skill level. - Automatic sequence operation: After placing the sample, complex operations are unnecessary; vacuum, venting, and gas introduction are executed with just button presses. - Access to the internal sample chamber through the upper door. - Effective heating range: φ6-φ8 inch (other sizes available). - High vacuum atmosphere compatible (with turbo addition: 1x10-5 Torr). - Status of 8 interlock systems can be confirmed via front LED lamps. ◆ Basic Specifications ◆ - Heating element: CC composite. - Insulation material: Graphite, Tungsten/Molybdenum. - Power specifications: AC200V 70A 14KW (*for 8 inch 2 zones). - Max 2000℃. - Operating atmosphere: Vacuum/Inert gas, Vacuum/Inert gas. - Programmable temperature controller, C thermocouple. ◆ Options ◆ - 2-zone control (*for 6, 8 inch). - Recorder. - Turbo molecular pump. - Wafer holder. ◆ Main Applications ◆ - Electronic devices such as SiC, GaN. - Applications in the development of other advanced materials.

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