【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected with the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible.
basic information
【Device Configuration Example】 *Chamber-1. MiniLab-E080A (Evaporation Device) ・EB Evaporation: 7cc Crucible x 6 ・Resistance Heating Evaporation x 2 ・Organic Evaporation Limit x 2 *Chamber-2. MiniLab-S060A (Sputtering Device) ・Φ2" Magnetron Cathode x 4, Simultaneous Sputtering, DC and RF Compatible *Chamber-3. Load Lock Chamber ・Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC Substrate Bias Stage," and the company's proprietary 'Soft Etching' technology allows for <30W low-power, damage-free plasma etching stages. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Price information
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Applications/Examples of results
Manufacturing factories for electronic devices, fuel cells, displays, universities and research institutions, pharmaceutical and chemical factories, food factories, and many others.
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[SH Vacuum Substrate Additional High-Temperature Plate Heater_Max 1100℃] For CVD and PVD Vacuum Thin Films
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【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
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【Endless possibility_thermal engineering...】 Our company sells vacuum thin film devices for semiconductor and electronic device fundamental research, ultra-high temperature heaters for CVD substrate heating, experimental furnaces, temperature measurement equipment, and more. To meet the endless demand for "heat," which is indispensable in any era, and to respond to various requests in the field of fundamental technology development, we aim to introduce the latest equipment and contribute to research and development in Japan.